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Slim Speaker

What is the advantage of Slim Speaker?

  • Simple process : In just two soldering points
  • Increased work efficiency : Optimized voice coil soldering
  • Prevention of voice coil disconnection Thermal emission : Heat sink
  • Temperature change : 180℃ --> Under 80℃
  • The top and bottom of the heat sink are exposed in the frame
  • Prevented deformation of parts due to high temperature
  • Prevented demagnetization of neodymium magnet
  • Stiffness reinforcement in the central part
  • Minimization of vibration loss in the central part
  • Prevention of mode vibration
  • SPL reinforcement and planarization
Specification
Dimension (L)85 x (W)18 x (T)13.1 mm
Long term power 10 W
Nominal impedence 8 ohm ± 15 % at 1.0 V, 1 kHz
D.C.R 8 ohm ± 15 %
Resonance frequency (fo) 280 Hz ± 20 % at 1.0 V
Averaged SPL 80 dB ± 3 dB at 1.0 W, 1.0 m at 500, 600, 800, 1000
Buzz & Rattle test 7.74 Vrms Input signal: Sine wave
Distortion Less 6 % between 300 Hz and 1kHz
Less 3 % above 1 kHz 		Input power: 1W
Frequency range fo - 20 kHz Deviation: 10 dB max

SPL Vs. Frequency at 2.38 V, 1.0 m

Impedance Vs Frequency at 1.0 V

Slim Speaker

Dimension (W)18 X (L)85 X (T)8 mm
Input 10 W
SPL 80 dB
F0 250 Hz
Dimension (W)35 X (L)35 X (T)5 mm
Input 5 W
SPL 80 dB
F0 300 Hz

Slim Wooper

Dimension (W)80 X (L)80 X (T)8 mm
Input 10 W
SPL 80 dB
F0 150 Hz

General Speaker

Dimension Input SPL F0
(W)25 X (L)82 X (T)20 mm 5 W 80 dB 280 Hz
(W)25 X (L)82 X (T)28 mm 10 W 81 dB 240 Hz
(W)33 X (L)140 X (T)30 10 W 81 dB 230 Hz
Dimension Input SPL F0
(W)66 X (L)66 X (T)13.4 mm 10 W 80 dB 140 Hz
(W)66 X (L)66 X (T)22 mm 10 W 80 dB 140 Hz
(W)205 X (L)205 X (T)80 10 W 81 dB 230 Hz
Dimension Input SPL F0
(W)155 X (L)155 X (T)60 mm - W 97.5 dB 130 Hz
(W)205 X (L)205 X (T)80 mm - W 97.5 dB 130 Hz
(W)205 X (L)205 X (T)80 - W 97.5 dB 80 Hz

Tweeter

Dimension Input SPL F0
(W)14 X (L)29 X (T)12 mm 10 W 80 dB 1250 Hz
(W)14 X (L)29 X (T)12 mm 10 W 82 dB 3500 Hz
(W)25 X (L)25 X (T)5.5 10 W 84 dB 3000 Hz

Global rights for the Source technology and Element technology

Title of invention Application Registration Overseas
application
No. Date No. Date
Speaker device 10-2013-029520 2013.03.20      
Bobbin for speaker device
and speaker device usingsame		 10-2013-069380 2013.03.20      
Diaphragm of speaker device 10-2014-065504 2014.05.30      
Magnetic circuit assembly for
speaker device		 10-2014-066353 2014.05.30      
Diaphragm for speaker device 10-2014-154827 2014.11.08     CHINA, GERMANY, USA
Diaphragm assembly 10-2015-008376 2015.01.17 1564896 2015.10.23 CHINA, GERMANY, USA
Speaker device 10-25-15-024875 2015.02.23 1560363 2015.10.07 CHINA
Diaphragm for speaker device 10-2015-111551 2015.08.07 1560365 2015.10.07  
Diaphragm assembly 10-2015-146940 2015.10.21      
Diaphragm assembly 10-2016-005265 2016.01.15      
A Suspension for speaker device
and a speaker device using the same		 10-2016-049942 2016.04.25 1625932 2016.05.25 CHINA
Slim speaker 10-2016-059992 2016.05.17      
Title of invention Application Registration Overseas
application
No. Date No. Date
Slim spraker 10-2016-097509 2016.07.29     CHINA
Connecting Structure Between
Diaphragm and Edge for Slim Spraker		 10-2016-148802 2016.11.09 1737813 2017.05.15  
Slim Enclosure Assembly 10-2017-064258 2017.05.24      
Speaker Assembly and method of assembling the same 10-2017-073133 2017.06.12      
Diaphragm for speaker device 30-2016-019855 2016.04.26 878732 2016.10.24  
Suspension for speaker device 30-2016-019857 2016.04.26 878733 2016.10.24